2.5 mm x 3.2 mm ceramic package smd oscillator, ttl / hc-mos ism97 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 6/05/12 _b specifications subjec t to change without notice page 1 recommended pad layout 1.3 1.4 2.0 2.6 dimension units: mm pin connection 1 enable 2 gnd 3 output 4 vcc product features: applications: low jitter, non-pll based output fibre channel cmos/ttl compatible logic levels server & storage compatible with leadfree processing sonet /sdh 802.11 / wifi t1/e1, t3/e3 system clock note: a 0.01 f bypass capacitor is recommended between vcc (p in 4) and gnd (pin 2) to minimize power supply noise. * not available at all frequencies. ** not available for all temperature ranges. *** frequency, supply, and load related p arameters. frequency 1.000 mhz to 152.250 mhz output level hc-mos ttl ?0? = 0.1 vcc max., ?1? = 0.9 vcc min. ?0? = 0.4 vdc max., ?1? = 2.4 vdc min. duty cycle specify 50% 10% or 5% see table in part number guide rise / fall time 6 ns max. output load see table in part number guide frequency stability see frequency stability table (includes room temperature tolerance and stability over operating temperature) start-up time 10 ms max. enable / disable time 100 ns max. n.c. or 70% vdd = enable. 30% vdd = disable. supply voltage see input voltage table, tolerance 5 % current 25 ma max. (5.0v) 20 ma max. (1.8v-3.3v) operating see operating temperature table in part number guide storage -55 ? c to +125 ? c jitter: rms(1sigma) 1 mhz-60 mhz 5 ps rms (1 sigma) max. accumulated jitter (20k adjacent periods) max integrated 1 mhz-60 mhz 1.5 ps rms (1 sigma -12khz to 20mhz) max total jitter 1 mhz-60 mhz 50 ps p-p (100k adjacent periods) part number guide sample part number: i sm97 - 3251bh - 20.000 package input voltage operating temperature symmetry (duty cycle) output stability (in ppm) enable / disable frequency i sm97 - 5 = 5.0 v 1 = 0 ? c to +70 ? c 5 = 45 / 55 max. 1 = 10ttl / 15 pf hc-mos **e = ? 10 h = enable - 20.000 mhz 3 = 3.3 v 6 = -10 ? c to +70 ? c 6 = 40 / 60 max. 6 = 30 pf **d = ? 15 o = n/c 7 = 3.0 v 3 = -20 ? c to +70 ? c 5 = 50 pf hc-mos (<40 mhz) **f = ? 20 2 = 2.7 v 4 = -30 ? c to +75 ? c **a = ? 25 6 = 2.5 v 2 = -40 ? c to +85 ? c b = ? 50 1 = 1.8 v* c = ? 100
2.5 mm x 3.2 mm ceramic package smd oscillator, ttl / hc-mos ism97 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 6/05/12 _b specifications subjec t to change without notice page 2 pb free solder reflow profile: typical application: *units are backward compatible with 240c reflow processes package information: msl = n.a. (package does not contain plastic, storage life is unlimited under normal room conditions). termination = e4 (au over ni over w base metalization). tape and reel information: environmental specifications thermal shock mil-std-883, method 1011, condition a moisture resistance mil-std-883, method 1004 mechanical shock mil-std-883, method 2002, condition b mechanical vibration mil-std-883, method 2007, condition a resistance to soldering heat j-std-020c, tabl e 5-2 pb-free devices (except 2 cycles max) hazardous substance pb-free / rohs / green compliant solderability jesd22-b102-d method 2 (preconditioning e) terminal strength mil-std-883, method 2004, test condition d gross leak mil-std-883, method 1014, condition c fine leak mil-std-883, method 1014, condition a2, r1=2x10-8 atm cc/s solvent resistance mil-std-202, method 215 marking line 1: ilsi, date code (yww) line 2: frequency quantity per reel 1000 a 16 +/-.3 b 8 +/-.2 c 7.5 +/-.2 d 17.5 +/-1 e 50 / 60 / 80 f 180 / 250
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